How to detect the stacking thickness of the components?

[[士哲...]]

How to detect the stacking thickness of the components? In the analysis of meat thickness, it is impossible to obtain the 3D nominal thickness of the components to compare the actual thickness of the grid!! ?

[[Na...]]

Hello,

you can create a material thickness on your nominal data and assign the measuring principle "referenced construction". An actual material thickness will be created. Then, you can check the nominal material thickness for "Material Thickness Comparison On Actual". This will result in a colored deviation between nominal and actual:

https://techguide.gom.com/en/article/cmd_comparison_create_multiple_thickness_comparison_on_actual.html

Regards,
Nanno

[[士哲...]]

The single piece can be compared like this, but there is no way to analyze it in the assembly, there is no solution? We want to compare the abnormal thickness after assembly 

[[St...]]

Guten Morgen,

könnte man nicht zwei Schnitte anlegen und dann über Kontinuierlicher Kurvenabstand auswerten?

 

Grüße

[[士哲...]]

Hi

We want to use the thickness analysis function to quickly make analysis results, and use the color temperature method to find abnormal locations, but there is no way to analyze it in the assembly

[[Be...]]

Hi,

unfortunately there is no easy way to get the results you expect and for e.g. for CT measurements you would need that each of your assembly parts could be analyzed as a single assembly. What you can try as a workaround: Modify your CAD in GOMInspect that you remove patches from your assembly which couldn't be measured with an Atos Scanner. Simply select these patches and delete these patches. May be you need the 'Edit mode' of the CAD if the CAD is separated into different bodies to have a visual access to these patches.

You can contact also your local GOM partner and supply the data. Then we would be able to determine if there are more efficient strategies.

Hope this helps?!

Regards,

Bernd

[[士哲...]]

Hi
The merger of the CAD single piece may be a feasible plan, but this is not an efficient approach, especially in our product development process, more likely to make CAD errors, hope to break through, efficient analysis, this is urgent need .